Compact multi-process dry pumps

A300 : The BEST pumping speed in a COMPACT package

With a pumping speed well above 300 m3/h the A300 offers you more flexibility. For many applications, 300 mm included, the use of an additional roots blower is not required. This pump is designed with well proven solutions for the harshest and most corrosive applications. The A300 offers very high pumping performance for all semiconductor processes yet it is significantly more compact than today’s conventional dry pump.

Three times smaller, it consumes less energy and less water than traditional pumps. It uses the well-proven Adixen five stages multi-roots technology to achieve more than 300 m3/h pumping speed.

Particular attention was made to noise and vibration levels. Acoustic pressure level is reduced by 65% compared to traditional pumps.

Compact design allows pump to be located in Basement, Sub Floor or Point Of Use on the process tool further reducing installation costs.

Features Benefits
• Compact design
• Low noise level
• Low vibration
• Robust design
• Based on proven components
• High pumping speed in a compact package
• Equivalent to pump and blower package
• CE
• Semi S2-0200 compliant

Benefits
• Easy to integrate
• Clean room compatible
• Reduced installation costs
• Highest reliability for medium and harsh processes
• Lower cost of ownership
• Lower investment
• Highest safety level

Applications
• Etch (metal, poly, dielectric…)
• Implant (source)
• HDPCVD
• PECVD
• LPCVD
• Stripping / Ashing